描述了振动抛光机的结构和半导体单晶样品的抛光工艺。从加工的质量来看,我们可以在实验室技术条件下,利用振动抛光法来加工出表面无损的样品。同时,还能用此法剥掉物质的一些薄层。 Described the vibration polishing machine structure and semiconductor single crystal polishing process. From the quality of the processing point of view, we can in the laboratory under the conditions of technology, the use of vibration polishing method to produce non-destructive surface samples. At the same time, you can also use this method to strip some of the material layer.