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采用溶胶-凝胶法制取白炭黑载体,在一定条件下,将具有杀菌性能的Cu2+、Ag+附着在白炭黑载体上,制得含Cu2+、Ag+双组分杀菌活性成分的无机粉体抗菌材料。运用ICP、粒度分布仪和FTIR等手段对材料中抗菌离子含量、粒度以及抗菌离子与载体的结合方式等进行了表征。并利用菌落计数法对材料的抗菌性能进行研究。结果表明,Cu-Ag双组分抗菌白炭黑中,抗菌离子含量高于单组分抗菌白炭黑;其中,Cu2+是通过离子交换方式结合到白炭黑上的,而Ag+是通过离子交换和吸附两种方式结合到白炭黑上;材料的杀菌率达99%以上;粒径<7μm且均一。
Under certain conditions, Cu2 + and Ag + with bactericidal properties are attached to the silica carrier to prepare an antibacterial inorganic powder containing Cu2 + and Ag + two-component bactericidal active ingredients material. The antimicrobial ion content, particle size and the combination of antibacterial ion and carrier were characterized by means of ICP, particle size distribution analyzer and FTIR. The antibacterial properties of the materials were studied by colony counting method. The results showed that the content of antibacterial ion in Cu-Ag bicomponent antibacterial silica was higher than that of monocomponent antibacterial silica. Among them, Cu2 + was bound to silica via ion exchange, while Ag + And adsorption of two ways to the white carbon black; sterilization rate of more than 99% of materials; particle size <7μm and uniform.