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自蔓延反应能在极短时间内产生足够集中的热量熔化钎料实现材料的连接,具有连接效率高、对连接母材热影响小等特点,从而在材料连接和电子封装领域有着广泛的应用前景。针对Cu/Cu和Cu/Si两种互连结构,建立Ai/Ni薄膜自蔓延反应的连接温度场有限元模型,分析不同钎料厚度、预热条件等参数以及不同连接材料对自蔓延反应连接温度场的影响规律。
Self-propagating reaction in a very short period of time to produce enough heat to melt the solder to achieve the connection of the material, with high efficiency, small thermal effects on the connection base metal characteristics, which in the field of material connection and electronic packaging has broad application prospects . According to the Cu / Cu and Cu / Si interconnects, a finite element model of the connection temperature field of Ai / Ni thin film self-propagating reaction was established. Parameters of different solder thicknesses, preheating conditions, The influence law of temperature field.