论文部分内容阅读
最好的方法是在选择测试策略前首先考虑最终产品的性能。简单的故障(如短路和开路)会在高密度组装的电路板中引起更多的故障。不同的产品需要不同的测试策略。几乎每个人都同意应开发具有可测性的系统。开路和短路问题随着表面贴装技术的推广正在增加。
The best way is to first consider the performance of the final product before choosing a test strategy. Simple faults, such as shorts and opens, can cause more problems in high density circuit boards. Different products require different testing strategies. Almost everyone agrees that a testable system should be developed. Open and short circuit problems are increasing with surface mount technology.