采用扩散焊接法制备出了Pb-Sn-Al复合电极材料。借助线形扫描伏安法(LSV)、SEM测试手段研究了不同工艺参数对Pb-Al复合材料界面及电化学性能的影响。结果表明,在230℃、2 h或1 h下扩散焊接条件下,得到了界面冶金式结合的Pb-Al复合材料;与液固包覆法制备的电极材料相比,界面结合明显改善;与传统Pb电极相比,槽电压降低40 mV,极化电位降低4%。 Pb-Sn-Al composite electrode materials were prepared by diffusion welding. The effects of different process parameters on the interface and electrochemical properties of Pb-Al composites were investigated by means of linear sweep voltammetry (LSV) and SEM. The results show that the interfacial metallurgical bonding Pb-Al composites are obtained under the condition of 230 ℃, 2 h or 1 h diffusion bonding. Compared with the electrode materials prepared by liquid-solid coating, the interfacial bonding is obviously improved. Compared with the conventional Pb electrode, the cell voltage is reduced by 40 mV and the polarization potential is reduced by 4%.