论文部分内容阅读
本文利用国际上近几年发展起来的一种新型显微成像工具──扫描电子声显微镜（ＳＥＡＭ－ＳｃａｎｎｉｎｇＥｌｅｃｔｒｏｎＡｃｏｕｓｔｉｃＭｉｃｒｏｓｃｏｐｅ）对几种类型的半导体材料进行了电子声成像观察与研究．文中简述了扫描电子声显微镜的电子声成像机理和其工作原理．从获得的电子声图像上，反映出扫描电子声显微成像技术在对半导体材料的亚表面缺陷和掺杂分布方面有着直接观察与显示的能力．同时与相应位置所获得的二次电子像进行了比较，显示出了电子声显微成像技术的独特之处和潜在的应用价值．
In this paper, several new types of microscopic imaging tools developed in recent years, namely, SEAM (Scanning Electron Acoustic Microscope), have been used to observe and study the electro-acoustic imaging of several types of semiconductor materials. In this paper, the electronic sound imaging mechanism and its working principle of scanning electronic sound microscope are briefly described. From the obtained electronic sound image, the scanning electron sonographic imaging technology has the ability of directly observing and displaying the subsurface defects and the doping distribution of the semiconductor material. At the same time, the secondary electron images obtained from the corresponding positions are compared, showing the uniqueness and potential application value of the electro-acoustic micro-imaging technology.