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提出了过冷单相合金的定向凝固问题。与常规定向凝固不同,这种定向凝固是在界面前负的温度梯度之下进行的。其进行的必要条件是热扩散作用在枝晶生长过程中处于主导地位。以Cu-30％Ni合金进行实验,在105～155K的过冷度范围内获得了定向凝固组织。实验结果同时表明,该定向凝固的最终组织为单晶体。
The problem of directional solidification of the undercooled single-phase alloy is proposed. Unlike conventional directional solidification, this directional solidification is performed under a negative temperature gradient before the interface. Its necessary condition is that thermal diffusion plays a dominant role in dendrite growth. Experiments with Cu-30% Ni alloy were carried out to obtain the directional solidification structure in the undercooling range of 105 ~ 155K. The experimental results also show that the final solidification of the directional solidification of single crystal.