论文部分内容阅读
针对厚胶曝光参数随不同光刻胶厚度及工艺条件变化的特点,在原有Dill曝光模型基础上,建立了适合于描述厚胶曝光过程的增强Dill模型,并将统计分析的趋势面法引入到厚胶曝光参数变化规律的研究中,给出了厚胶AZ4562曝光参数随胶厚及工艺条件的变化趋势,为开展厚胶光刻实验研究和曝光过程模拟提供指导性依据。
Aiming at the characteristics of thick plastic exposure parameters with different photoresist thickness and process conditions, based on the original Dill exposure model, an enhanced Dill model suitable for describing the thick rubber exposure process is established, and the statistical analysis of the trend surface method is introduced In the research of the change rule of the thick glue exposure parameters, the changing trend of the exposure parameters of the thick glue AZ4562 with the thickness of the glue and the process conditions is given, which provides the guiding evidence for carrying out the thick glue lithography experimental research and the exposure process simulation.