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用微波烧结工艺成功制备了铜包裹碳化硅颗粒增强铝基(SiC–Cu/Al)复合材料,利用扫描电镜和X射线衍射分析仪对烧结样品进行表征,并讨论了烧结过程及机理。研究表明:采用多晶莫来石纤维棉、硅碳棒和氧化铝坩锅组合设计的保温结构能很好地促进烧结。烧结温度为720℃时,SiC–Cu/Al复合材料的密度取得最大值为2.53g/cm3。SiC–Cu/Al复合材料的硬度随烧结温度的升高的变化成马鞍状。烧结温度对样品显微结构的影响较大,随着烧结温度的升高,相分布的均匀性降低,在较高的烧结温度下会出现SiC颗粒的偏聚。涡流损耗和界面极化损耗是促进微波烧结的主要动力。
Copper-encapsulated SiC-Cu / Al composites were successfully prepared by microwave sintering process. The sintered samples were characterized by scanning electron microscopy and X-ray diffraction analyzer. The sintering process and mechanism were also discussed. The research shows that the thermal insulation structure designed by the combination of polycrystalline mullite fiber cotton, silicon carbon rod and alumina crucible can promote the sintering well. When the sintering temperature is 720 ℃, the maximum density of SiC-Cu / Al composites is 2.53g / cm3. The hardness of SiC-Cu / Al composites changed saddle shape with the increase of sintering temperature. The sintering temperature has a great influence on the microstructure of the sample. As the sintering temperature increases, the uniformity of the phase distribution decreases. At higher sintering temperature, segregation of SiC particles occurs. Eddy current loss and interface polarization loss is the main driving force for microwave sintering.