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MST,是一种新技术:具有较高的组装密度。 单片系统技术(MST)是设计和制造产品的一种方法,这种技术比以前的技术有更高的组装密度,该技术的基本单元是芯片(基片)。芯片装在组件里,组件装在可插入底板的逻辑插件上。若干底板装配成转门,再由转门组成机架。底板、转门和机架用电缆互连。 MST技术有各种各样的类型,每种类型在电路速度,电压,插件和底板尺寸方面各有差异。
MST, a new technology: has a higher packing density. Monolithic System Technology (MST) is a method of designing and manufacturing products that have a higher packing density than previous technologies, the basic unit of which is the chip (substrate). The chip is housed in a module that is mounted on a logic card that plugs into the backplane. A number of backplane assembly turnstiles, and then turn the door to form a rack. The backplane, turnstiles and racks are interconnected by cables. There are a variety of types of MST technology, each of which varies in circuit speed, voltage, plug-in, and backplane dimensions.