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4月,环球仪器在上海的先进工艺实验室举行了系统封装技术研讨会和实用课程,与业界分享它利用专利的晶圆直接供料(DDF)方式进行系统封装的最新技术。
In April, Universal held a system packaging technology seminar and practical course at the Advanced Craft Laboratory in Shanghai to share with the industry the latest technology of its system packaging using the patented DDF method.