论文部分内容阅读
用Al/Ni/Al复合层真空连接Si_3N_4陶瓷,研究了Al与Ni的匹配对接头显微组织的影响以及影响接头强度的因素。结果表明,当Al与Ni的匹配合理并采用适当的连接工艺时,Al与Si_3N_4和Al与Ni的互扩散和反应可分别获得牢固的结合界面和以Al_3Ni耐高温相为主的焊缝金属,获得耐高温的陶瓷接头;Ni的厚度、连接温度及保温时间是影响接头强度的重要参数,它们的最佳值分别为40μm、900℃和60min,对应接头600℃剪切强度为58.7MPa。
Si_3N_4 ceramic was vacuum-connected with Al / Ni / Al composite layer to study the effect of the matching of Al and Ni on the microstructure of the joint and the factors that affect the strength of the joint. The results show that the interdiffusion and reaction of Al, Si_3N_4 and Al with Ni can obtain the strong bonding interface and the weld metal mainly composed of Al_3Ni high temperature phase when the matching of Al and Ni is reasonable and the proper connection process is adopted. The thickness, connection temperature and holding time of Ni are important parameters that affect the strength of the joint. The best values of them are 40μm, 900 ℃ and 60min, respectively. The corresponding shear strength at 600 ℃ is 58.7MPa.