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为了改善硅微机械扭转微镜的机电耦合特性,降低器件的驱动电压并提高其工作可靠性,提出了几种新颖的基于复合静电驱动结构的硅微机械扭转微镜.提出的硅微机械扭转微镜将垂直扭转梳齿静电驱动结构、侧壁平行板电容静电驱动结构有机结合,实现了两种静电驱动方式的复合驱动,同时设计了内外双镜面结构,通过内外双镜面结构,实现了微镜的差动复合驱动,理论分析、模拟仿真与测试结果表明,通过上述两个方面新颖的设计,新结构显著降低了器件的驱动电压.同时为了提高器件的工作可靠性,在设计折叠梁柔性支撑结构时,将梁的不同位置设计成不同的厚度,对于硅微机械扭转微镜扭转过程中容易疲劳的梁部分加大了其厚度,从而在不影响器件扭转性能的前提下,明显提高了器件的可靠性.利用有限元方法对器件的力学特性和机电耦合特性进行了系统的仿真,获得了影响器件机电特性的关键结构参数.器件基于SOI晶片,采用表面硅工艺与体硅工艺相结合的方式加工制造,采用SOI晶片显著降低了微镜镜面的表面粗糙度,提高了其光反射能力.最后利用原子力显微镜对微镜镜面的表面粗糙度进行了测量和分析,实验结果表面微镜表面具有16nm的表面粗糙度,完全可以满足光学应用的需要.
In order to improve the electromechanical coupling properties of the micromechanical micromirror and to reduce the driving voltage of the micromechanical micromirror and to improve the reliability of the micromechanical micromechanical micromechanics, several novel micromechanical micromechanical micromechanical micromechanical micromechanics The micromirror combines the electrostatic driving structure of the comb tooth with vertical twist and the electrostatic driving structure of the parallel plate capacitor on the side wall to realize the compound driving of the two kinds of electrostatic driving modes and design the inner and outer double mirror structures simultaneously. The results show that the new structure can significantly reduce the driving voltage of the device through the novel design of the above two aspects.At the same time, in order to improve the reliability of the device, When supporting the structure, different positions of the beam are designed to have different thicknesses, and the thickness of the beam is increased easily during the torsion of the silicon micromechanical torsion micromirror so that the torsion performance of the device is obviously improved The reliability of the device. The finite element method is used to simulate the mechanical and electromechanical coupling characteristics of the device. The key structural parameters that affect the electromechanical properties of the devices are obtained.The devices are fabricated on the basis of SOI wafers, using a combination of surface and bulk silicon processes, SOI wafers significantly reduce the surface roughness of the micromirrors and increase their light reflectivity At last, the surface roughness of the mirror surface was measured and analyzed by atomic force microscopy. The experimental results show that the surface of the mirror surface has a surface roughness of 16nm, which can fully meet the needs of optical applications.