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Ｔ／Ｒ组件的高密度微波封装据《１９９５ＩＥＥＥＭＴＴ－ｓＤｉｇｅｓｔ》报道，休斯飞机公司的ＪｏｈｎＷｏｏｌｄｒｉｄｇｅ开发出一种Ｘ波段有源阵列雷达用Ｔ／Ｒ组件的低成本三维高密度微波封装（ＨＤＭＰ）技术。该项目主要集中在多层氮化铝（ＡＩＮ）衬底的设计、...
High-Density Microwave Packaging for T / R Components According to a report by 1995IEEEMTT-sDigest, John Wooldridge of Hughes Aircraft Corporation has developed a low-cost three-dimensional high-density microwave packaging (HDMP) technology for T / R components for X-band active array radar . The project focuses on the design of multilayer aluminum nitride (AIN) substrates, ...