应用传热工程解决电子设备的温升控制,已日益成为结构设计人员关心的问题。从维护电子设备运行的可靠性看,必须限制电子元器件的最高(或最低)温度;为使电路的性能最佳,则元件之间的温度变化应减至最小。因此,电子设备热设计的根本任务在于从热源至热耗散环境之间提供一条尽可能低的热阻通路,通常称为冷却系统的设计。传统的冷却方法,一般是利用某些介 Application of heat transfer engineering to solve the temperature control of electronic equipment has become increasingly concerned about the structural design issues. From the standpoint of maintaining the reliability of electronic equipment operation, the maximum (or minimum) temperature of the electronic components must be limited; for optimum circuit performance, temperature changes between components should be minimized. Therefore, the fundamental task of electronic device thermal design is to provide a thermal resistance path that is as low as possible from the heat source to the thermal dissipation environment, often referred to as the cooling system design. The traditional method of cooling, the general use of certain media