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对表面安装器件的印制板的测试是很难的,最大的障碍在于缺少测试探头所需的空间。采用表面安装技术(SMT)的器件体积很小,比过孔器件要小得多。由于器件较小、排列较密集,所以测试夹具也变得很难制作。
The test of the printed circuit board of the surface mount device is very difficult, the biggest obstacle lies in the lack of space required to test the probe. Devices using Surface Mount Technology (SMT) are small in size and much smaller than through-hole devices. Test fixtures have also become harder to fabricate due to the smaller devices and the more dense arrangement.