随着晶圆尺寸的不断扩大,300mm 晶圆生产线已陆续投产,预计2002年全球有10 家300mm 晶圆加工厂,2003年还将有7—8家建成投产。据 Semico 公司预计,300mm晶圆将占2002年晶圆产量的5%,到2006年将增至35%。由于300mm 晶圆尺寸大,容易受到各种影响而导致成品率下降,为了确保成本因素,300mm 晶圆必须采用单晶圆加 With the continuous expansion of wafer size, 300mm wafer production line has been put into operation one after another, is expected in 2002 there are 10 300mm wafer processing plants in 2003 there will be 7-8 completed and put into production. According to Semico, 300mm wafers will account for 5% of wafer production in 2002 and 35% by 2006. As 300mm wafer size, susceptible to various effects and lead to decline in yield, in order to ensure cost factors, 300mm wafer must be single-wafer plus