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一、引言铜及铜基合金在含氯离子介质中,表面可形成一层氧化膜,许多研究工作者对此进行了大量的研究。Kruger考察了蒸馏水中铜表面膜的生长动力学。Blundy指出Cu-Ni合金表面膜的主要组份为Cu_2O,合金元素Ni、Fe不影响Cu_2O膜的结构。膜中也发现有少量的Cu_2(OH)_3Cl,有时发生偏聚,形成岛状沉积。关于膜的厚度,文献中报导不一,一般为几千埃。目前多数人认为,铜及铜合金在含氯离子介质中的耐蚀性是由于表面生成的这一层氧化膜,但对这层膜影响金属腐蚀的具体机制研究得较少,多数文献只讨论了极化组抗Rp的变化。本文作者用电化学方法,结合表面分析结果,对铜镍合金B-30(以下简称B-30)生成表面膜过程中及生成表面膜后的电化学反应机制进行了讨论;对电化学极化过程,和浸泡过程中所形成的表面膜的性能进行了比较,对其差异进行了初步探讨。
I. INTRODUCTION Copper and copper-based alloys can form an oxide film on the surface in chloride-containing media. Many researchers have done a lot of research on this. Kruger examined the growth kinetics of copper surface films in distilled water. Blundy pointed out that Cu-Ni alloy surface film is the main component of Cu_2O, alloying elements Ni, Fe does not affect the structure of Cu_2O film. The film also found a small amount of Cu_2 (OH) _3Cl, sometimes segregation, the formation of island-like deposits. The thickness of the film, reported in the literature vary, generally several thousand angstroms. At present, most people think that the corrosion resistance of copper and copper alloy in chloride ion-containing medium is due to the surface oxide film, but the specific mechanism of this film affecting metal corrosion has been less studied. Most of the literature only discusses The polarization group anti-Rp changes. In this paper, the electrochemical reaction mechanism of the Cu-Ni alloy B-30 (hereinafter referred to as B-30) surface film formation and the surface film formation was discussed by electrochemical method combined with the surface analysis results. Electrochemical polarization Process, and soaked in the formation of the performance of the surface membrane were compared, the differences were discussed.