论文部分内容阅读
电阻加热具有比较好的加热均匀性,可以认为对于非升华性材料,具有比较理想的平面源发射特性n=1。而电子束加热时,通常n=2~3,甚至可以为6,发射特性参数的范围大,没有取值指导理论或规律,具有很大的不确定性,这对分析薄膜均匀性非常不利。采用细分蒸发源为无数个小的面蒸发源的思想,建立了镀膜材料出现挖坑效应时薄膜厚度均匀性的分析模型。分析结果表明电子束蒸发方法很难获得理想的平面蒸发源,不同程度的挖坑效应将使得n值不同程度地偏离n=1,挖坑效应越明显,n值越大。可以从镀膜机结构设计及薄膜沉积工艺选取两方面着手,降低挖坑效应带来的影响。该研究对认识蒸发源材料发射特性的物理含义具有重要意义,对实验工作同样具有指导性意义。
Resistance heating has better heating uniformity, it can be considered for non-sublimation materials, has a more ideal planar source emission characteristics of n = 1. The electron beam heating, usually n = 2 ~ 3, or even 6, the emission characteristics of a wide range of parameters, there is no value to guide the theory or law, with great uncertainty, which is very unfavorable for the analysis of film uniformity. Based on the idea of subdividing evaporating sources into countless small surface evaporation sources, an analytical model of film thickness uniformity was established. The results show that it is difficult to obtain the ideal planar evaporation source by electron beam evaporation method. Different degrees of digging effect will make n value deviate from n = 1 to some extent, the more significant the digging effect and the larger the value of n. From the coating machine structure design and thin film deposition process to select two aspects to reduce the impact of digging effect. This study is of great significance to understand the physical meaning of the emission characteristics of the evaporation source material and is also instructive for experimental work.