磨削技术的现状 在日本,引人注目的最新磨削技术方向是电子部件和光学零件的精密研磨,即以陶瓷加工、硅片的超精密抛光(镜面研磨)为主,以及单品兰宝石,玻璃,Mn—Zn铁氧体的单晶体的研磨等等。但是,今天暂不谈这些超精密研磨技术,而针对普通的磨削技术做一叙述。 在回首瞻望过去几年磨削技术发展的同时,列举几项今后将要开展的磨削研究课题。 Current status of grinding technology In Japan, the most noticeable newest grinding technology is precision grinding of electronic components and optical components, that is, ceramic processing, super-precision polishing of silicon wafer (mirror grinding), and single product sapphire , Glass, single crystal of Mn-Zn ferrite, and the like. However, we will not talk about these ultra-precision grinding technologies for now, but we will make a description of ordinary grinding technologies. Looking back at the development of grinding technology in the past few years, we will give a few examples of grinding research to be carried out in the future.