随着计算机技术的不断进步,频率越来越高的CPU、功能越来越强大的显示卡、速度越来越快的硬盘、光驱等计算机配件的产生,计算机的性能正以惊人的速度不断发展。但随之而来的便是这些计算机配件的发热量比以前大大增加,再加上如今风行的超频之风,更是火上浇油,使本已狭小的机箱内真正地成为一个“火炉”,系统的稳定性很难得到保证。如何在现有的条件下,尽可能地加强机箱内的散热,已经成为困扰计算机爱好者的一大难题。希望笔者下面的一些经验和一家之言能给你一些启示和帮助。 With the continuous improvement of computer technology, CPUs with higher and higher frequencies, more and more powerful graphics cards, faster and faster generation of computer accessories such as hard disks, CD-ROMs and the like, the performance of the computer is being developed at an alarming rate . But then comes the heat of these computer accessories greatly increased than before, coupled with the now popular overclocking style, it is fuel on fire, so that the already small chassis really become a “stove” , The stability of the system is hard to be guaranteed. How to strengthen the heat dissipation in the chassis as much as possible under the existing conditions has become a major problem that plagues computer enthusiasts. I hope some of the following experience and one of the words of the author can give you some inspiration and help.