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随着半导体制造技术不断向微细化、高速、高密度方向发展,开发高精度、高效率、高可靠性的键合机是对封装设备制造业刻不容缓的要求.而深入认识、分析和改善键合机的机械结构与性能成为广大科研工作者面临的首要任务.利用虚拟机技术软件(ADAMS)建立了某键合机的动力学模型,并通过仿真验证了模型的正确性;利用有限元分析软件(PANTRAN)分析了该键合机中关键部件的物性特性对整机精度的影响,并得出初步的结论.
With the continuous development of semiconductor manufacturing technology toward miniaturization, high speed and high density, it is an urgent requirement to develop a high precision, high efficiency and high reliability bonding machine for packaging equipment manufacturing industry, and in-depth understanding, analysis and improvement of bonding The mechanical structure and performance of the machine become the primary task facing the majority of researchers.Using the virtual machine technology software (ADAMS) to establish a bond machine dynamics model and verify the correctness of the model by simulation; using finite element analysis software (PANTRAN) analysis of the key components of the bonding machine physical properties of the machine accuracy, and draw the preliminary conclusions.