晶圆级芯片尺寸封装(WCSP)消除了类似传统的芯片键合、引线键合和倒装芯片贴装过程的封装工序。这种办法可以为半导体产品用户实现更快的上市时间。WCSP封装应用空间正在扩大到新的领域,并根据管脚数量和器件类型进行细分。WCSP封装正在集成无源、分立元件、射频和存储器器件方面得到应用,并扩展到逻辑集成电路和MEMS器件。但伴随着这种应用的增长出现了很多问题,其中包括随着芯片尺寸和管脚数量的増长对电路板可靠性的影响。概述当今的挑战,以及这些集成和硅通孔技术的未来趋势。 Wafer Level Chip Scale Package (WCSP) eliminates packaging processes similar to traditional chip bonding, wire bonding, and flip chip mounting. This approach enables faster time-to-market for semiconductor product users. WCSP package application space is being expanded to new areas and broken down by pin count and device type. The WCSP package is being used to integrate passive, discrete components, radio frequency and memory devices and extends to logic integrated circuits and MEMS devices. However, there are many problems associated with the growth of such applications, including the impact on circuit board reliability as the size of the chip and the number of pins increase. Summarize today’s challenges and the future trends of these integrated and through-silicon vias.