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A new basic electrolyte with two cationic plating additives,polydiaminourea and polyaminosulfone,was investigated for the electrochemical deposition of the bismuth telluride film on a nickel-plated copper foil.Tellurium starts to deposit at a higher potential(-0.35 V) than bismuth(-0.5 V) in this electrolyte.The tellurium-to-bismuth ratio increases while the deposition potential declines from-1 to-1.25 V, indicating a kinetically quicker bismuth deposition at higher potentials.The as-deposited film features good adhesion to the substrate and smooth morphology,and has a nearly amorphous crystal structure disclosed by X-ray diffraction patterns.
A new basic electrolyte with two cationic plating additives, polydiaminourea and polyaminosulfone, was investigated for the electrochemical deposition of the bismuth telluride film on a nickel-plated copper foil. Tellurium starts to deposit at a higher potential (-0.35 V) than bismuth (- 0.5 V) in this electrolyte. The tellurium-to-bismuth ratio increases while the deposition potential declines from-1 to-1.25 V, indicating a kinetically quicker bismuth deposition at higher potentials. The as-deposited film features good adhesion to the substrate and smooth morphology, and has a nearly amorphous crystal structure disclosed by X-ray diffraction patterns.