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中国科学院微电子研究所系统封装技术研究室主要从事先进电子封装与集成技术的研究与开发。针对后摩尔时代集成电路向三维集成技术发展的趋势,以及对电子系统小型化、多功能、高性能、高可靠、低成本、低能耗的需求,研究室团队开展三维集成技术、系统级封装、高密度封装、特种封装等关键技术研发,同时进行先进高密度光/无线互连集成技术研究与产品开发。
Institute of Microelectronics, Chinese Academy of Sciences System Packaging Technology Laboratory mainly engaged in advanced electronic packaging and integration technology research and development. Aiming at the trend of integrated circuits to 3D integrated technology in the Post-Moore era and the demand for miniaturization, multi-function, high performance, high reliability, low cost and low energy consumption of electronic systems, the research team conducted three-dimensional integration, system- High-density packaging, special packaging and other key technologies research and development, advanced high-density optical / wireless interconnect integration technology research and product development.