当集成电路设计者和系统制造商普遍关注工艺技术、生产、信号完整性和日益增长的封装复杂性等问题的时候,一个新问题日益成为集成电路和系统设计的关键。对今天的许多电子制造商来说,任何开发工作都要严格检验所使用产品对环境的影响,并遵循全球的环境规范。目前环境关注的焦点集中在对含铅电子产品的处理方面,因此在制造电子设备时的绿色封装成为最高的呼声。 When IC designers and system makers are generally concerned with issues such as process technology, production, signal integrity, and increasing package complexity, a new issue is increasingly becoming the key to integrated circuit and system design. For many electronics manufacturers today, any development effort must rigorously test the environmental impact of the products they use and follow global environmental regulations. At present, the focus of environmental concern is on the processing of lead-based electronic products, so green packaging in the manufacture of electronic devices has become the highest voice.