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采用表面活性剂(A)改性豆粕的方法制备了无甲醛大豆基胶粘剂。研究了A的用量、热压时间和热压温度对大豆基胶粘剂胶合性能的影响,采用差示扫描量热(DSC)仪对大豆基胶粘剂的热性能进行了研究。研究结果表明,当w(A)=2.5%(相对于豆粕而言)、热压时间为15min和热压温度为140～160℃时,大豆基胶粘剂表现出最佳的胶合强度;其主要的热反应在160℃以下完成。
The formaldehyde-free soy-based adhesive was prepared by modifying the soybean meal with surfactant (A). The effects of the amount of A, hot pressing time and hot pressing temperature on the bonding properties of soybean based adhesive were studied. The thermal properties of soybean based adhesive were studied by differential scanning calorimetry (DSC). The results showed that the soy-based adhesive showed the best adhesive strength when w (A) = 2.5% (relative to soybean meal), hot pressing time was 15 min and hot pressing temperature was 140 ~ 160 ℃. The main The thermal reaction is completed below 160 ° C.