论文部分内容阅读
瑞士的Ｄｏｒｎａｃｈ金属公司开发成功了两种电阻率小而且抗热松弛性良好的高强度可硬化铜镍合金 ,这种铜镍合金是电子设备适用的良好材料。厚度≤ 0 2ｍｍ的ＣｕＮｉ1Ｐ合金带材 ,屈服强度为 72 0ＭＰａ ,导电率可达ＩＡＣＳ(国际标准退火铜 )的 6 0 % (3 4 8ＭＳ/ｍ)的水平
Dornach Metals, Switzerland, has successfully developed two high-strength hardenable copper-nickel alloys with low resistivity and good thermal relaxation resistance. This copper-nickel alloy is a good material for electronic devices. The CuNi1P alloy strip with a thickness of 0 2 mm has a yield strength of 72 0 MPa and a conductivity of 60% (34 8 MS / m) of IACS (International Standard Annealed Copper)