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一、前言脉冲化学镀是在化学镀的基础上叠加脉冲电流,在脉冲导通期间除了发生化学沉积外,还同时进行电沉积。而在脉冲间隔期间,则只进行化学沉积。目前,关于脉冲化学镀的研究报导甚少。Mallory的研究表明:化学镀叠加脉冲电流以后,镀速可加快数倍。王妹荣等的研究表明:脉冲化学镀的镀速远大于化学镀和脉冲镀镀速之和。至于产生上述现象的根本原因,目前还没有一个完美的解释。
First, the foreword Electroless plating is superimposed on the basis of electroless plating pulse current, in addition to the pulse during the chemical deposition, but also at the same time electrodeposition. During the pulse interval, only chemical deposition is performed. At present, little research has been reported on pulsed electroless plating. Mallory’s research shows that: after plating and pulsed current, plating speed can be accelerated several times. Wang-mei-rong and other studies have shown that: the plating speed of electroless plating is far greater than the sum of electroless plating and pulse plating speed. As for the root causes of the above phenomenon, there is not a perfect explanation.