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织物用黏合剂常用于小的修补或将2种纺织材料连接在一起。在智能纺织品领域,织物用黏合剂可保护小型电子装置使其免受因临界机械载荷或水洗引起的与织物基材的分离。着眼于黏合剂应用于表面贴装器件(SMD)接点处的应力释放,采用分离测试和Martindale耐磨测试对不同的胶接点进行了研究。
Fabric adhesives are commonly used for small repairs or to join two types of textile material together. In the field of smart textiles, fabric binders protect small electronic devices from the textile substrate due to critical mechanical loads or water washing. Focusing on the application of the adhesive to stress relief at surface mount devices (SMD) contacts, different adhesive junctions were investigated using a separation test and a Martindale abrasion test.