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据资料报导,获取EMI(电磁干扰)/RFI(射频干扰)金属导电层的工艺方法有多种,其中化学镀工艺方法因其具有镀层均匀、连续、孔隙少,不受零件尺寸及外形限制,环境可靠性高等优点而得到迅速发展,并已广泛应用于电子仪器壳体及零部件的屏蔽。化学镀电磁屏蔽层新工艺研究在我国还刚刚起步。703所现已取得可靠的成果。
According to the information reported, there are many kinds of technological methods to obtain the EMI (electromagnetic interference) / RFI (radio frequency interference) metal conductive layer. The electroless plating method is uniform in coating, continuous and less in pores, and is not limited by the size and shape of the part. The advantages of high environmental reliability and rapid development, and has been widely used in electronic equipment shell and parts shielding. Electroless plating electromagnetic shielding new technology research in our country has just started. 703 has now achieved reliable results.