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用正电子湮没Doppler展宽能谱测量了一系列经不同热处理的Cu-23at％Zn-10at％Al合金试样。结果表明:在Cu基形状记忆合金热弹马氏体稳定化研究中所假设的诸多机制中,淬火空位是最根本的机制;了解淬火空位的运动特征和尽快地消除淬火空位是优化热处理工艺并得到理想记忆元件的基础。
A series of Cu-23at% Zn-10at% Al alloy samples with different heat treatments were measured by positron annihilation Doppler broadening energy spectrum. The results show that quenching vacancy is the most fundamental mechanism among the many mechanisms assumed in the study of thermoelastic martensite stabilization of Cu-based shape memory alloys. Understanding the kinematic characteristics of quenching vacancy and eliminating quenching vacancies as soon as possible are the key factors to optimize the heat treatment process Get the ideal memory component basis.