研究了合金元素对ＣｕＮｉＳｉ 系列引线框架用铜合金性能的影响。发现合金中时效析出物具有与δＮｉ２Ｓｉ 相似的晶体结构，Ｎｉ 及Ｓｉ 元素含量对材料硬度和电导率有很大影响。当Ｎｉ 及Ｓｉ 元素含量增大时， 由于析出物数量增多， 材料硬度增加； 当Ｎｉ 与Ｓｉ 原子数之比小于２ 时， 材料电导率明显下降，这是由于过剩Ｓｉ 元素以固溶原子形式存在， 强烈损害材料电导率的结果。加入Ｚｎ 元素后， 保温过程中Ｚｎ 元素在合金与ＳｎＰｂ 共晶焊料界面处偏聚， 阻碍脆性金属间化合物层的形成， 在４２５ Ｋ 保温１ ０００ ｈ后， 铜合金与焊料间结合良好。 The effects of alloying elements on the properties of CuNiSi lead frame copper alloys were studied. It is found that the aging precipitates have the same crystal structure as δNi2Si. The contents of Ni and Si have a great influence on the hardness and conductivity of the alloy. When the content of Ni and Si elements increases, the hardness of the material increases due to the increase of the amount of precipitates. When the ratio of Ni to Si atoms is less than 2, the conductivity of the material decreases obviously due to the presence of excess Si element as a solute atom , Strongly detrimental to the conductivity of the material. When Zn is added, the Zn element segregates at the interface between the alloy and the Sn-Pb eutectic solder during the heat preservation process, hindering the formation of the brittle intermetallic compound layer. After being heated at 425 K for 1000 h, the bonding between the copper alloy and the solder is good.