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采用半固态触变液固分离工艺制备出底部具有高体积分数SiC(63 vol%)的Al基功能梯度电子封装壳体,借助光学显微镜和扫描电镜分析了壳体复合材料中SiC的形态分布及其断口形貌,并测定了其热物理性能和力学性能。结果表明,原始30vol%SiCp/Al复合材料在半固态触变成形中SiC颗粒和液相产生分离流动,液相从壳体中流出,SiC颗粒在壳体中聚集,其体积分数从壳体底面向四壁逐渐降低。组织和性能呈梯度变化。壳体底面具有高的热导率和低的热膨胀系数(CTE),这与芯片材料相匹配,壳体四壁具有良好的焊接性能。
A semi-solid thixotropic liquid-solid separation process was used to fabricate a Al-based functional graded electronic package with a high volume fraction of SiC (63 vol%) on the bottom. The morphology distribution of SiC in the shell composite was analyzed by optical microscopy and scanning electron microscopy Its fracture appearance and its thermal physical properties and mechanical properties were measured. The results show that in the semi-solid thixoforming of the original 30vol% SiCp / Al composites, the SiC particles and the liquid phase separate and flow, the liquid phase flows out of the shell, and the SiC particles gather in the shell, The bottom gradually decreases toward the four walls. Tissue and properties showed a gradient. The bottom surface of the housing has high thermal conductivity and low coefficient of thermal expansion (CTE), which matches with the chip material, and the four walls of the housing have good welding performance.