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一种成功的抗蚀剂和刻蚀残渣去除胶机必须满足大批量IC制造环境中可接受的3个条件:(1)与灵敏低K介质材料的兼容性;(2)去除抗蚀剂和刻蚀残渣;(3)与基质金属包括铜、钴、钨等金属的兼容性。而AirProdul公司的EZ系列去胶机成功地满足了这些要求。一些含氟化物的产品与灵敏的低k介质,例如多孔的低k材料、HSQ和其它超低k材料是能够很好共处的。对由测量刻蚀速率以及键合保留物和暴露于这些除胶机的覆盖膜组成的介质材料确定的兼容性进行了评价,并对作图衬底的浸泡试验所确定的清洗效力也一并进行了评价。
A successful resist and etch residue remover must meet the three acceptable conditions for high volume IC manufacturing environments: (1) compatibility with sensitive low-K dielectric materials, (2) removal of resist and Etching residue; (3) Compatibility with matrix metals including metals such as copper, cobalt and tungsten. AirProdul’s EZ series of gluing machines successfully meet these requirements. Some fluoride-containing products and sensitive low-k media, such as porous low-k materials, HSQ and other ultra-low k materials are able to coexist well. The compatibility determined by measuring the etch rate and the dielectric material consisting of the bond retentate and the cover film exposed to these guillotine dispensers was evaluated and also the cleaning efficacy determined for the immersion test on the patterned substrate was also taken together did an evaluation.