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  5. Deposition and characterization for high-quality Ti-Ni-Cu thin films with higher Cu content

Deposition and characterization for high-quality Ti-Ni-Cu thin films with higher Cu content

来源 :稀有金属:英文版 | 被引量 : 0次 | 上传用户：kenshin578212121
【摘 要】
：
In order to attain high-quality Ti-Ni-Cu film,the surface morphologies,chemical compositions and mechanical properties of Ti-Ni-Cu thin films prepared by direct current(DC)magnetron sputtering at various processes were characterized by scanning electron m
【作 者】
：
Jun Li Xiao-Yang Yi Yu Zheng Jing Wang Hai-Zhen Wang Xiang-Long Meng Zhi-Yong Gao Yue-Hui Ma 
【机 构】
：
CollegeofMechanicalandElectricalEngineering,SchoolofMaterialsScienceandEngineering,LanzhouSeemineSMA
【出 处】
：
稀有金属:英文版
【发表日期】
：
2021年8期
【关键词】
：
Ti-Ni-Cu thin film DC magnetron sputtering Sputtering parameters Chemical compos 
【基金项目】
：
financially supported by the National Natural Science Foundation of China(Nos.51801023,51871080 and 51571073),the Industrial Transformation&Upgrading of Strong Base Project of China(No.TC150B5C0/0
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In order to attain high-quality Ti-Ni-Cu film,the surface morphologies,chemical compositions and mechanical properties of Ti-Ni-Cu thin films prepared by direct current(DC)magnetron sputtering at various processes were characterized by scanning electron m
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