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在T8钢表面脉冲电沉积Ni-SiC镀层,用扫描电镜(SEM)、显微硬度计、X射线衍射仪(XRD)等研究电流密度对Ni-SiC镀层的表面粗糙度、内应力、显微硬度和组织结构的影响。结果表明:电流密度为6 A/dm~2时,Ni-SiC镀层表面粗糙度达到最小值(0.66μm),内应力达到最小值(120 MPa),显微硬度达到最大值(828HV);电流密度为6 A/dm~2时,Ni-SiC镀层表面颗粒尺寸较小,粗糙度较低,镀层致密性较好;Ni-SiC镀层为面心立方结构,且电流密度为6 A/dm~2时,镀层(111)晶面衍射强度较高。
Ni-SiC coating was pulsed electrodeposited on T8 steel surface. The surface roughness, internal stress and microstructure of Ni-SiC coating were studied by scanning electron microscopy (SEM), microhardness tester and X-ray diffractometer (XRD) Effect of hardness and structure. The results show that the surface roughness of Ni-SiC coating reaches the minimum (0.66μm), the internal stress reaches the minimum (120MPa) and the microhardness reaches the maximum (828HV) when the current density is 6 A / dm ~ 2. Ni-SiC coating has a face-centered cubic structure and a current density of 6 A / dm ~ 2 when the density is 6 A / dm ~ 2. 2, the coating (111) crystal surface diffraction intensity higher.