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随着表面贴装元件应用越来越广,表面贴装技术逐渐成为电子组装的主流技术。表面贴装元件不同于通孔安装元件,其焊接技术要求比对通孔安装元件的焊接技术要求高的多。
With the application of surface mount components more widely, surface mount technology has become the mainstream technology of electronic assembly. Surface-mount components differ from through-hole mount components in that they require much higher soldering technology than soldering technology for through-hole mounting components.