IBM公司采用激光微通孔技术促进了倒装片组装技术的发展。该公司所开发的第二代封装技术是在安装基板上直接搭载裸芯片的倒装片组装技术方面成功地实现了基板的进一步小型化和高密度化。在新开发出来的第二代封装技术中,采用了激光通孔法代替了原来的光通孔法。这就 IBM has used laser micro via technology to facilitate flip-chip assembly technology. The second-generation packaging technology developed by the company succeeded in further miniaturizing and densifying the substrate in the flip chip assembly technology of directly mounting a bare chip on a mounting substrate. In the newly developed second-generation packaging technology, the use of laser through-hole method instead of the original through-hole method. This is