对256元和512元InGaAs线列探测器进行了气密封装,对封装结构和工艺中的几个关键技术进行了分析,包括热电致冷器的热负载性能、温度烘烤性能、组件密封性。研究结果表明:在室温条件下,热电致冷器的致冷温差可以达到55 K以上,热负载每增加50 mW,致冷温差下降约0.51 K,能够满足组件的使用要求。经过120℃、500 h的烘烤后,热电致冷器仍能保持性能不变。组件的密封性达到了国军标的要求。 The 256 yuan and 512 yuan InGaAs line detector was hermetically sealed package structure and process of several key technologies were analyzed, including the thermoelectric cooler thermal load performance, temperature baking performance, component sealing . The results show that the refrigeration temperature difference of thermoelectric cooler can reach more than 55 K at room temperature, and the cooling temperature difference decreases about 0.51 K for every 50 mW increase in thermal load, which can meet the requirements of component usage. After 120 ℃, 500 h baking, the thermoelectric cooler can still maintain the same performance. Sealing components to meet the national standard requirements.