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苯并噁嗪树脂具有低黏度,耐潮性优异,线性膨胀系数低和耐热性较高的优点,现广泛应用于电子电气、航空航天和汽车工业中。将苯并噁嗪树脂引入到电子封装材料中,以制备耐潮、耐热和可加工性能优异的满足新型封装要求的高性能电子封装材料,这些都需要对其进行结构改造。就苯并噁嗪树脂应用研究中存在的高耐热高阻燃性、增韧可加工性、低温固化工艺以及优良电性能方面的改性进行探讨,指出了通过分子设计结构、有机无机共混共聚及固化工艺改进等几种解决途径。
Benzoxazine resin has the advantages of low viscosity, excellent resistance to moisture, low coefficient of linear expansion and high heat resistance. It is widely used in the fields of electronic, electrical, aerospace and automotive industries. Benzoxazine resins are introduced into electronic packaging materials to make high-performance electronic packaging materials that are resistant to moisture, heat and processability and meet the requirements of new packaging, all of which require structural modification. In the application of benzoxazine resin, the research on the modification of high heat resistance, high flame retardancy, toughening workability, low temperature curing process and excellent electrical properties are discussed. It is pointed out that through the molecular design of the structure, organic-inorganic blending Copolymerization and curing process improvements and other solutions.