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采用Ag-Cu钎料用于透氧膜与不锈钢支撑体之间的封接,研究了Cu含量对Ag-Cu钎料钎焊透氧膜界面结构的影响。利用SEM对连接界面的显微组织进行观察,并用EDS对界面的相组成进行分析。结果表明:纯Ag与透氧膜陶瓷之间的连接界面无元素互扩散;Ag中少量1at%Cu的添加并未明显改善钎焊连接界面;当Cu含量增加到3.3at%时,在透氧膜一侧生成一层由Cu和Ag扩散所致的厚度约200μm的反应层,反应层的生成表明Ag-3.3Cu钎料与透氧膜之间具有良好的润湿性和界面结合。
Ag-Cu brazing filler metal was used to seal between the oxygen-permeable membrane and the stainless steel support. The effect of Cu content on the interface structure of the brazing oxygen-permeable membrane with Ag-Cu brazing filler metal was studied. The microstructure of the interface was observed by SEM, and the phase composition of the interface was analyzed by EDS. The results show that there is no elemental interdiffusion at the interface between the pure Ag and the oxygen-permeable film ceramic. The addition of a small amount of 1 at% Cu in Ag does not significantly improve the soldering interface. When the Cu content increases to 3.3 at% A reaction layer with a thickness of about 200 μm caused by the diffusion of Cu and Ag is formed on one side of the membrane. The formation of the reaction layer shows that the Ag-3.3 Cu solder has good wettability and interface bonding with the oxygen-permeable membrane.