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采用金相显微镜、透射电镜、X射线衍射及拉伸测试方法,研究了低温等通道(ECAP-LT)变形Cu-Zn合金微观组织与力学性能的变化规律。结果表明:Cu-Zn合金经低温ECAP挤压后,形成了纳米孪晶。随着层错能的降低,平均晶粒尺寸逐渐减小(~200 nm),纳米孪晶密度增大;显微硬度、屈服强度和抗拉强度逐渐提高,均匀伸长率呈现增大趋势。屈服强度与晶粒尺寸的关系符合典型的Hall-Petch方程。
The microstructure and mechanical properties of Cu-Zn alloy deformed by ECAP-LT were studied by metallographic microscope, transmission electron microscope, X-ray diffraction and tensile test. The results show that nano-twin is formed after Cu-Zn alloy is extruded by low temperature ECAP. As the stacking fault energy decreases, the average grain size decreases gradually (~ 200 nm) and the nano twin density increases. The microhardness, yield strength and tensile strength increase gradually, and the uniform elongation increases. The relationship between yield strength and grain size conforms to the typical Hall-Petch equation.