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阐述了金属基复合材料用于电子封装领域的优点及其重要意义,综述了该研究方向最新研究现状,归纳了金属基电子封装复合材料制造方法,指出了未来研究方向。
The advantages and significance of metal matrix composites in the field of electronic packaging are expounded. The latest research status of the research is summarized. The manufacturing methods of metal - based electronic packaging composites are summarized, and the future research directions are pointed out.