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研究了不同SOH对焊点微观组织和抗拉强度的影响。用拉伸试验的方法在SOH低于100μm的条件下分析Cu/Sn-8Zn-3Bi/Cu和Cu/Sn-9Zn/Cu焊点的力学特性。结果表明,随着SOH的减少,针状的富Zn相在这2个焊点中逐渐减少。在Cu/Sn-9Zn/Cu焊点中会形成金属间化合物Cu5Zn8,在Cu/Sn-8Zn-3Bi/Cu焊点中形成一层金属间化合物Cu5Zn8和另一层Cu-Sn和Cu-Zn的混合相。Cu/Sn-9Zn/Cu焊点的极限抗拉强度会随SOH的减少而降低,而Cu/Sn-8Zn-3Bi/Cu焊点则相反。
The effect of different SOH on the microstructure and tensile strength of the solder joint was studied. The mechanical properties of Cu / Sn-8Zn-3Bi / Cu and Cu / Sn-9Zn / Cu solder joints were analyzed by tensile test at SOH below 100μm. The results show that acicular Zn-rich phase decreases gradually with the decrease of SOH. An intermetallic compound Cu5Zn8 is formed in the Cu / Sn-9Zn / Cu solder joint. An intermetallic compound Cu5Zn8 and another Cu-Sn and Cu-Zn solder are formed in the Cu / Sn-8Zn-3Bi / Cu solder joint Mixed phase. The ultimate tensile strength of Cu / Sn-9Zn / Cu solder joint decreases with the decrease of SOH, while the Cu / Sn-8Zn-3Bi / Cu solder joint is the opposite.