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研究了(Bi,Pb)-2223/Ag带材在第1次热处理后,不同的冷却速率对其输运性能和微观结构的影响。利用XRD、SEM等分析手段对样品进行表征。结果表明:随着冷却速率的降低,带材中的2201相不断减少直至消失,而Ca2PbO4相的含量却不断增加;与此同时,带材中第二相粒子的尺寸也不断增大。带材的输运电流测量表明,随冷却速率(对数坐标)的降低,样品的临界电流密度线性增加,同时,带材在磁场下的性能也不断提高。这是由于慢冷导致(Bi,Pb)-2223/Ag带材的晶粒连接性变好和磁通钉扎能力提高造成的。
The effects of different cooling rates on the transport properties and microstructure of (Bi, Pb) -2223 / Ag strip after the first heat treatment were investigated. The samples were characterized by XRD, SEM and other analytical methods. The results show that with the decrease of cooling rate, the amount of phase 2201 in the strip decreases until it disappears while the content of Ca2PbO4 phase increases. At the same time, the size of the second phase particles in the strip increases. The measured transport current of the strip shows that the critical current density increases linearly with decreasing cooling rate (logarithmic scale), and the properties of the strip in the magnetic field are also increasing. This is due to the improved die-to-grain connectivity of the (Bi, Pb) -2223 / Ag tape due to slow cooling and the increased flux pinning capability.