据港台媒体报导,美国巴隆金融周刊(Barron″s)最新一期专访三星电子(Samsung)半导体事业群总裁暨执行官黄昌圭指出,三星锁定高端、客制化产品,大规模切入晶圆代工市场,市场取向有别于台积电,2005下半年开始导入量产,黄昌圭虽不愿明言客户名单,但消息人士则透露,投单客户之一则是通信芯片大厂高通国际(Oualcomm)。 According to Hong Kong and Taiwan media reports, the latest Barron’s interview with Samsung Corp. Huang Changgui, president and executive officer of the Semiconductor Business Group, pointed out that Samsung has locked in high-end and customized products and cut the wafer on a large scale Market, the market orientation is different from the TSMC, the second half of 2005 began to introduce mass production, although Huang Chang-yu unwilling to say that the list of customers, but sources revealed that one of the investment customers is communication chip maker Qualcomm International (Oualcomm).