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挠性和可伸缩电路技术在航天应用Flexible and Stretchable Circuit Technologies for Space Applications挠性电路技术能减小体积和重量、加强电气性能、提高互连可靠性和有更大的设计自由度,这些优势吸引了航天应用。文章主要介绍超薄芯片封装(UTCP)和可拉伸模块互连(SMI)两项技术例子。UTCP是一个20 mm厚的芯片封装成0 mm厚的组件,再把UTCP埋置于FPCB中。SMI的原理刚挠PCB技术,铜导线设计成蜿
Flexible and Stretchable Circuit Technologies in Space Applications Flexible circuit technology reduces the size and weight, enhances electrical performance, increases interconnection reliability and greater design freedom, all of which are attractive Space applications. The article focuses on two technical examples of ultra-thin chip package (UTCP) and extensible module interconnect (SMI). UTCP is a 20 mm thick chip packaged into a 0 mm thick piece, which is then embedded in FPCB. The principle of SMI Rigid PCB technology, copper wire design into a meandering