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本文叙述了半导体光电器件树脂封装的特点、工艺方法及现今达到的气密性、可靠性水平,并对树脂封装技术作了初步探计。
This article describes the characteristics of the semiconductor package of semiconductor optoelectronic devices, process methods and the current level of air tightness, reliability, and resin packaging technology made a preliminary exploration.