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现代表面分析技术已广泛应用于当代科学的各个领域中。应用俄歇电子谱学(AES)与X-射线光电子谱学(XPS或ESCA)研究自由表面或内界面的化学成分分布及化合物的化学结合状态,对于分析金属材料、复合材料以及粘接、镀层、腐蚀等领域有关结合强度、断裂机理、缺陷成因等问题有重要意义。对于电子元器件失效分析,这些技术尤为重要。 从本期开始,我们将组织稿件介绍有关这些先进分析技术的基础理论和在材料工艺研究中的应用情况。
Modern surface analysis technology has been widely used in all fields of contemporary science. Application of Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS or ESCA) to study the chemical composition of the free surface or the interface and chemical bonding state, the analysis of metal materials, composites and bonding, coating , Corrosion and other fields related to the bonding strength, fracture mechanism, the causes of defects and other issues of great significance. These techniques are especially important for failure analysis of electronic components. Starting from this issue, we will organize manuscripts to introduce the basic theories of these advanced analytical techniques and their application in the study of materials technology.